In accordance with one embodiment of the present invention, an apparatus of moderate cost is provided which can readily releasably connect an integrated circuit to a circuit board. The apparatus includes a socket that can be readily mounted on the circuit board, the socket forming a largely rectangular cavity which closely receives the integrated circuit. The socket has a lower portion forming vertical through slots, each slot extending parallel to one of the sides of the rectangular socket. An elongated vertically-compressible interface device lies in each of the slots, each interface device having a row of compressible conductors with upper ends pressing against conductive pads on the underside of the integrated circuit, and each compressible conduc tor having a lower end pressing against a conductive trace on the circuit board. A cover or the like mounts on the socket and presses the integrated circuit down wardly into the socket, to compress the interface de vices to interconnect the integrated circuit to the circuit board.