In-Situ Monitoring of Photoresist Thickness Contour (2006)
Type of ContentConference Contributions - Published
PublisherUniversity of Canterbury. Mechanical Engineering.
In microelectronics processing, coating of photoresist is a common process. It is important to ensure the uniformity of the photoresist thickness across the wafer. In this paper, we propose an in-situ monitoring system. In the setup, a spectrometer is used to measure the photoresist thickness contour on the wafer after the spin-coat step or edge-bead removal step. The experimental results are compared with off-line ellipsometer measurements. The worst-case error is experimentally found to be less than 2%.
CitationHo, W.K., Chen, X.Z., Wu, X.D., Tay, A. (2006) In-Situ Monitoring of Photoresist Thickness Contour. Singapore: 2006 4th IEEE International Conference on Industrial Informatics (INDIN), 16-18 Aug 2006. Proceedings of 2006 IEEE International Conference on Industrial Informatics, 1091-1095.
This citation is automatically generated and may be unreliable. Use as a guide only.
Showing items related by title, author, creator and subject.
de Passille, Bruno (2003)The Continent Of science, Antarctica, bares an indescribable source Of data which contain solutions for several mysteries that scientists try to elucidate. The Antarctic ice shelves are one of them. Surveying and recording ...
Deriving Antarctic Sea Ice Thickness from Remote Sensing using Artificial Neural Networks and Genetic Algorithm Schroeter, Ben (2015)This paper investigates the applicability of the Artificial Neural Network (ANN) learning paradigm in deriving sea ice thickness in the Antarctic using a combination of physical measurements, Landsat-8 satellite imag ...
Stolte, Andrew; Cox, Brandy; Wotherspoon, Liam (2018)The direct-push crosshole (DPCH) test is an invasive, near-surface seismic testing method, which combines the high-quality, high-resolution velocity measurements of borehole-based crosshole (CH) seismic testing with the ...