High Vibration Sensors: Modelling, Design and Integration (2009)
Type of ContentConference Contributions - Published
PublisherUniversity of Canterbury. Mechanical Engineering
AuthorsRochus, V., Gutschmidt, S., Golinval, J., Saint-Mard, M., Heusdens, B., Haudry, F., Destiné, J.show all
Since many years, the University of Liege is involved in micro-electronics and micro-electromechanical systems modelling, design and integration. Recently, the University of Liege had received the opportunity to build a brand new infrastructure (clean rooms - ISO 7) with specific equipments for packaging and MEMS characterisation. This new facility (clean rooms and equipments) enables the University to be very well positioned in the nano/micro-electronics modelling, analysis and packaging world and is now able to answer specific research and related industrial needs. In this paper we consider the design of a vibration sensor in its significantly vibrating surroundings and investigate in its dynamical behaviour. Environmental vibrations affect the sensor part of the MEMS device and influence the choice of the ldquobestrdquo packaging methods for the application. Within the framework of packaging, we consider a simple test application ensuring best interconnection technology. Dynamical investigations include a preliminary analysis of the packaging and a separate finite-element analysis of the MEMS device (inside the package), testing the device under the condition of a harsh environment (high vibration spectral level). Computations are proposed in combination with experimental observations.
CitationRochus, V., Gutschmidt, S., Golinval, J., Saint-Mard, M., Heusdens, B., Haudry, F., Destiné, J. (2009) High Vibration Sensors: Modelling, Design and Integration. Delft, The Netherlands: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems. EuroSimE 2009, 26-29 Apr 2009.
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