Tip Motion-Sensor Signal Relation for a Composite SPM/SPL Cantilever

Type of content
Journal Article
Thesis discipline
Degree name
Publisher
University of Canterbury. Mechanical Engineering
Journal Title
Journal ISSN
Volume Title
Language
Date
2015
Authors
Roeser, D.
Gutschmidt, S.
Sattel, T.
Rangelow, I.W.
Abstract

An array of microbeams is a promising approach to increase the throughput of scanning probe microscopes and lithography. This concept requires integrated sensors and actuators which enable individual measurement and control. Thus, existing models for single beams need to be reassessed in view of its applicability for arrays, which involve additional physical interactions and a varying geometry along the beam's length. This paper considers a single composite microbeam, which is excited by a thermal actuator and its displacement is measured by a piezoresistive sensor. We derive a model that incorporates the beam's composite structure, varying geometry along its length, its thermal coupling for actuation, and thermoelastic damping. Subsequently, the influence of the beam's geometry on its eigenmodes and frequencies is analyzed in far and close proximity operation to a surface. We observe parametric excitation phenomena of multiple integers of the fundamental excitation frequency, which originates from the geometrical composition of the beam. Furthermore, we observe that the so far constant assumed factor to convert the sensor signal to the beam's displacement depends on the dissipated power within the actuator, as well as on the dynamic behavior of the system, and thus is not constant.

Description
Citation
Roeser, D., Gutschmidt, S., Sattel, T., Rangelow, I.W. (2015) Tip Motion-Sensor Signal Relation for a Composite SPM/SPL Cantilever. Journal of Microelectromechanical Systems, 25(1), pp. 78-90.
Keywords
Arrays, thermal actuation, piezoresistive, microelectromechanical systems (MEMS), thermomechanical coupling
Ngā upoko tukutuku/Māori subject headings
ANZSRC fields of research
Fields of Research::40 - Engineering::4017 - Mechanical engineering::401705 - Microelectromechanical systems (MEMS)
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