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| Title: | In-Situ Monitoring of Photoresist Thickness Contour |
| Authors: | Ho, W.K.
Chen, X.Z.
Wu, X.D.
Tay, A. |
| Issue Date: | 2006 |
| Citation: | Ho, W.K., Chen, X.Z., Wu, X.D., Tay, A. (2006) In-Situ Monitoring of Photoresist Thickness Contour. Singapore: 2006 4th IEEE International Conference on Industrial Informatics (INDIN), 16-18 Aug 2006. Proceedings of 2006 IEEE International Conference on Industrial Informatics, 1091-1095. |
| Source: | http://dx.doi.org/10.1109/INDIN.2006.275769 |
| Abstract: | In microelectronics processing, coating of photoresist is a common process. It is important to ensure the uniformity of the photoresist thickness across the wafer. In this paper, we propose an in-situ monitoring system. In the setup, a spectrometer is used to measure the photoresist thickness contour on the wafer after the spin-coat step or edge-bead removal step. The experimental results are compared with off-line ellipsometer measurements. The worst-case error is experimentally found to be less than 2%. |
| Publisher: | University of Canterbury. Mechanical Engineering. |
| Research Fields: | Fields of Research::290000 Engineering and Technology::290900 Electrical and Electronic Engineering::290903 Other electronic engineering |
| URI: | http://hdl.handle.net/10092/495 |
| Rights URI: | http://library.canterbury.ac.nz/ir/rights.shtml |
| Appears in Collections: | Conference Contributions
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